PRODUCT SPEC
77G Millimeter-Wave Radar PCB
A 10-layer 1-stage HDI PCB for 77G millimeter-wave radar modules, using a Shengyi mmWave77 and FR-4 hybrid stackup. The board manages multiple impedance groups at +/-10%, OSP surface finish, L1/L2 and L9/L10 laser vias, L3/L8 resin-plugged vias, and dense antenna arrays on L1/L10. Critical controls include 2.0 mm +/-10% thickness, 3/3 mil inner routing, 8 mil outer antenna routing, 50 ohm single-ended and 100 ohm differential impedance, top-bottom antenna position within 3 mil, antenna dimensional accuracy of +/-15 um, corner accuracy within 10 um, and burr control of +/-10 um.
Specs
| Structure | Core+Core HDI structure |
| Layers | 10-layer 1-stage HDI |
| Material | Shengyi mmWave77 + FR-4 hybrid stackup |
| Board Thickness | 2.0 mm +/-10% |
| Line / Space | 3/3 mil inner, 8 mil outer antenna |
| Min Hole Size | 0.10 mm laser / 0.2 mm buried mechanical |
| Antenna Registration | <=3 mil top-bottom antenna position |
| Impedance | 50 ohm single-ended / 100 ohm differential +/-10% |
| Aspect Ratio | 1:1 |
| Antenna Dimensional Tolerance | +/-15 um |
| Antenna Corner Tolerance | <=10 um |
| Antenna Burr Tolerance | +/-10 um |
| Surface Finish | OSP |
Applications
AutomotiveEVIndustrial ControlInstrumentationTelecom
