Vehicle Ceramic Circuit Board

A 2-layer vehicle-grade ceramic circuit board built on Al2O3 direct bonded copper with a QDR FR-4 carrier, 0.94±0.10mm thick and 280um copper. The ceramic substrate gives much higher thermal conductivity than standard FR-4, so junction heat from power devices and LED arrays is pulled out fast and evenly. Thick 280um copper carries large currents without trace overheating, which matters for traction inverters, LED headlamp drivers, and on-board chargers. The DBC stack-up resists thermal cycling and vibration that would crack ordinary epoxy substrates, and the ceramic surface stays dimensionally stable from cold start to hot soak. Typical uses are automotive power modules, EV charging electronics, headlamp and tail-light boards, and other vehicle subsystems where heat and current density are the limiting design constraints.