
A 4-layer 1-stage HDI thin coil PCB on S1000-2M laminate, 0.45±0.10mm thick. The slim profile makes it suitable for embedded coil applications in wireless charging receivers, NFC modules, and compact sensor heads where stack height is the binding constraint. S1000-2M provides stable dielectric performance and low thermal expansion, which is important when fine traces and microvias are routed across a thin core. The HDI build with blind microvias frees up routing channels and lets the coil wind tightly without sacrificing escape routing on the inner layers. Typical uses are wearables, hearables, IoT sensor nodes, smart-home tags, and small medical devices where the host enclosure leaves only millimeters for the antenna or coil board.
Specs
| Layers | 4 |
| Material | S1000-2M |
| Board Thickness | 0.45±0.10mm |
| Characteristic | 1-stage HDI, ultra-thin |
Applications