Stacked Micro Via PCB

An 8-layer stacked micro via PCB built with 2-stage laser drilling and 1.6±0.16mm overall thickness, where laser-drilled microvias are stacked across consecutive dielectric layers to form direct vertical interconnects. Stacking removes the through-hole stub and frees routing channels under fine-pitch BGA and CSP devices, raising effective routing density without enlarging the board outline. The construction supports high-speed differential signaling and is widely used in telecom line cards, 5G small-cell radios, AI accelerator add-in boards, and high-end consumer modules where short, controlled-impedance vertical paths matter for signal integrity. Manufacturing requires copper-filled microvias, sequential lamination, and tight registration between drilled cores so each via stack maintains continuity through thermal cycling and reflow assembly.