Special Material Board

A 4-layer thin PCB at 0.6±0.1mm finished thickness, built on a specialty laminate and finished with ENEPIG. The substrate is selected for an application-specific property the customer's design needs — ultra-low loss tangent, dimensional stability under thermal cycling, low-CTE for wire bonding, controlled dielectric thickness, or RF performance — that ordinary FR-4 cannot deliver. ENEPIG is used in place of standard finishes because the palladium layer protects the nickel from corrosion, the flat surface supports both fine-pitch SMT and direct gold-wire bonding on the same pad, and contact resistance stays low across long service life. Typical fits are millimeter-wave radio modules, high-end optical modules, RF front-ends, satellite and aerospace electronics, military communications boards, medical sensor modules, and AI-accelerator interposer-class assemblies.