Server PCB

A single-sided aluminum-core PCB targeted at server-side power and thermal modules, with 2.3±0.23mm overall thickness combining an aluminum base, dielectric layer, and patterned copper foil. Aluminum-core construction conducts heat directly from power MOSFETs, voltage-regulator modules, and DC-DC converters into the chassis or heat sink, eliminating the need for separate thermal pads on high-current rails. Typical use cases include rack-server power input boards, GPU and AI-accelerator power stages, hot-swap distribution boards, and high-bay LED arrays for data-center cabinet lighting. The 2.3mm thickness adds mechanical rigidity for board-level fasteners and supports heavier copper sections for high-current traces, while the single-sided aluminum profile keeps assembly cost low for high-volume server-room deployments.