Semiconductor PCB

A 16-layer semiconductor-equipment PCB on FR408HR low-loss laminate at 2.4±0.24mm thickness, with depth-controlled drilling on the panel break-away tab to retain the working board through plating and assembly while keeping a clean tab edge for de-paneling. FR408HR provides stable dielectric constant and low loss across the GHz range, supporting fine-pitch BGA fan-out and controlled-impedance routing in semiconductor test heads, wafer-prober interface boards, ATE load boards, and high-density processor mainboards for AI and datacenter equipment. The 16-layer stack accommodates multiple signal pairs, dedicated power islands for analog test resources, and ground reference planes that contain crosstalk in dense load-board topologies.