
A semi-flex PCB built on standard FR-4 with controlled depth-routed thinning in the bend area, so a single one-piece board can hold rigid component zones at each end and a low-cycle bend-once or bend-few region in the middle. The thinned region is engineered for static install bends rather than continuous flexing, which lets the design avoid the cost and assembly overhead of a full rigid-flex stackup while still letting the board fold around a chassis edge, a battery, or a screen hinge during product assembly. The flex zone keeps the same copper layers running through, so routing of signal and power lines stays continuous without an interconnect joint. Typical fits are camera modules, wearable trackers, automotive interior trim controllers, household appliance control panels, and any product where the board has to fold once into its enclosure.
Specs
Detailed spec sheet on request — contact sales for the full data pack.
Applications