Printed Circuit Board With BGA

A 10-layer S1000H PCB at 0.8±0.08mm finished thickness, built with 2-stage HDI structure to support fine-pitch BGA packages. The HDI stackup combines staggered laser microvias with mechanical buried vias to free up routing space under the BGA footprint, allowing higher I/O density and shorter signal traces than a conventional through-hole design. S1000H gives the laminate a stable Tg and predictable dielectric properties for high-speed digital signals. Sihui Fuji controls layer-to-layer registration and microvia stacking to protect signal integrity and yield at fine pitches. Typical uses include telecom switch boards, AI server interface modules, datacenter line cards, advanced consumer electronics motherboards, and semiconductor test interface boards where high pin-count BGAs need clean breakout.