Pressure Sensor PCB

A 4-layer PCB on S1000H high-Tg FR-4 laminate at 1.6±0.16mm thickness, manufactured with mechanical blind holes for sensor element mounting and partial-depth interconnect. The blind holes provide pockets for MEMS pressure die or piezoresistive sensor elements, allowing direct media contact while keeping the sensing electronics isolated on inner layers. The 4-layer stackup hosts the sensor conditioning amplifier, calibration EEPROM, voltage regulators, and digital output stage on a compact form factor. S1000H provides the thermal stability needed for automotive under-hood and industrial process environments where temperature swings can be wide. Typical use cases include automotive manifold absolute pressure sensors, brake pressure modules, industrial process pressure transmitters, medical respiratory pressure monitors, HVAC differential pressure transducers, and IoT environmental nodes. Production requires controlled-depth mechanical drilling, registration of the blind cavity to the sensor footprint, and back-end calibration support during assembly.