Nickel Palladium Gold Plating Board

A 6-layer S1000H PCB at 1.00±0.1mm finished thickness, finished with ENEPIG (electroless nickel, electroless palladium, immersion gold). ENEPIG combines the corrosion resistance of nickel, the wire-bonding compatibility and black-pad mitigation of palladium, and the solderable, flat surface of immersion gold, which makes it the preferred finish where the same board hosts both surface-mount soldering and aluminum or gold wire bonding. The S1000H base laminate gives a stable Tg and predictable dielectric properties for medium-density digital signals, and the 6-layer stackup leaves room for clean ground and power planes under sensitive analog. Typical applications include medical instrumentation, telecom and microwave assemblies with bonded die, aerospace electronic modules, semiconductor probe and test boards, and high-reliability instrumentation.