PRODUCT SPEC
Multilayer Back-Drilled PCB
A 12-50 layer multilayer back-drilled PCB platform for high-speed, low-loss interconnects. The process supports high layer counts, high aspect ratios, multi-stage controlled-depth back drilling, strict impedance control, and tight expansion/shrinkage management. Capabilities include 1.6-5.4 mm board thickness, 3/3 mil inner routing, 3.5/3.5 mil outer routing, 0.10 mm laser vias, 0.15 mm mechanical drilling, 3 mil annular rings, 27:1 through-hole aspect ratio, and multiple high-reliability finishes.
Specs
| Structure | Multilayer back-drilled PCB, HDI structure |
| Layers | 12-50 |
| Board Thickness | 1.6-5.4 mm |
| Line / Space | 3/3 mil inner, 3.5/3.5 mil outer |
| Min Hole Size | 0.10 mm laser / 0.15 mm mechanical |
| Min Annular Ring | 3 mil |
| Hole-to-Conductor Spacing | 5 mil up to 20L, 6 mil for 20-50L, 7 mil for 50L+ |
| Aspect Ratio | 1:1 blind vias; 27:1 through holes |
| Dimensional Tolerance | +/-0.10 mm, special +/-0.05 mm |
| Surface Finish | ENIG, ENEPIG, Flash Gold, Hard Gold, OSP |
Applications
TelecomDatacenterAI ServerAerospaceIndustrial Control
