
A 30-layer ultra-high-layer-count PCB built on S1000-2M FR-4 to a finished thickness of 5.0±0.2/−0.5mm, finished with ENIG and gold plating on selected inner-layer pads. The high layer count gives the designer multiple full-thickness power and ground planes to handle motor-drive currents, dedicated layers for gate-driver routing, and isolated zones for the encoder, current-sense, and protection circuits inside one assembly. Inner-layer pad gold plating supports buried bonding and embedded-component construction, which keeps signal paths short between control silicon and power stages. The thick stack also adds mechanical rigidity for boards that have to bolt to motor end-bells or industrial drive enclosures. Typical fits are servo and stepper motor controllers, EV traction inverter control boards, robotic joint drive boards, factory drive cabinets, and high-end industrial motion-control modules.
Specs
| Layers | 30 |
| Material | S1000-2M |
| Board Thickness | 5.0±0.2/-0.5mm |
| Surface Finish | ENIG |
| Characteristic | Inner-layer pad gold plating |
Applications