Monitoring Camera PCB

An 8-layer S1000H PCB at 1.6±0.16mm finished thickness, built with 3-stage stacked laser microvias to support the dense BGA processors and image sensor interfaces inside a modern surveillance camera. The HDI structure pulls fine-pitch I/O directly into inner layers without consuming surface real estate, leaving space for power conversion, RF for Wi-Fi or PoE, and thermal management on the same small footprint. S1000H provides the dielectric stability needed for MIPI CSI-2 image-sensor links and high-speed memory buses. Sihui Fuji controls registration and copper plating across all three drill stages so the via stacks remain reliable through long thermal cycling. Typical applications include security and surveillance cameras, consumer IP cameras, IoT vision nodes, smart-home doorbells, and industrial vision controllers.