
A printed circuit board with plated castellated half-holes (also called edge-plated castellations) along its perimeter, designed to be soldered as a surface-mount module onto a larger motherboard. The half-holes are formed by drilling plated through holes near the board edge and then routing through the centers of those holes during profiling, leaving plated semi-circular contacts that act as solderable pads when the module is reflowed onto the host board. This construction lets compact submodules carry power, ground, and signal from a host PCB without connectors, saving height and BOM cost, and allows the module to be reworked or replaced without through-hole pins. Typical uses are radio modules, IoT and wearable submodules, sensor packs, industrial control daughterboards, and telecom modules where low profile and SMT-only assembly matter.
Specs
| Characteristic | castellated half-holes on board edge |
Applications