Measuring Radar PCB

An 8-layer hybrid PCB combining R-5515 high-frequency laminate with S1000-2M FR-4 at 1.5±0.15mm finished thickness, built with blind-via construction. The hybrid material plan puts the low-loss R-5515 only where the radar RF signal travels, and uses S1000-2M for the digital control, baseband, and power layers, which keeps overall cost in line with the volume profile of an industrial radar product. Blind vias keep RF transitions short and let the designer fan out a dense BGA digital signal-processor without disturbing the RF section. Sihui Fuji manages registration and lamination tolerances so the impedance step at the material boundary stays controlled. Typical applications include automotive radar, industrial level and distance measurement radar, instrumentation radar test gear, robotics LiDAR-class sensors, and defense radar subassemblies.