LED Module Substrate

A 6-layer FR-4 LED module substrate finished with ENIG surface plating, matt black solder mask, and white silkscreen. The board carries the LED chips and the surrounding driver components, providing mechanical support, electrical interconnect, and a thermal path that pulls heat away from the LED junctions. The matt black mask reduces optical reflection on lit fixtures and improves contrast for indicator-style applications, while ENIG produces flat solderable pads suitable for fine-pitch LED packages and small driver ICs. Six-layer construction gives enough copper density to route both the high-current LED supply and the lower-current driver and dimming signals on separate planes, improving thermal spreading and EMI behavior. Tight control of LED pad size and overall outline is the key quality control point. Typical uses are LED light fixtures, automotive lighting, indicator panels, and IoT lit displays.