Lamination PCB

A 12-layer lamination PCB at 1.6±0.16mm overall thickness, built from three different core-plate thicknesses laminated together to engineer specific dielectric distances between targeted signal and reference layers. The mixed-core stack lets the designer place tight 50/100-ohm impedance pairs adjacent to thin dielectrics while keeping power and ground planes on thicker cores for current capacity, all within a standard 1.6mm board outline. This approach reduces total layer count for boards that would otherwise need 14 or 16 uniform layers to hit the same impedance and noise targets. Typical applications include industrial gateways, base-station baseband boards, datacenter NIC and switch line cards, mid-volume consumer mainboards, and instrumentation backplanes where impedance control matters but cost discipline still applies.