Ladder Shaped Circuit Board
PRODUCT SPEC

Ladder Shaped Circuit Board

A stepped or ladder-profile PCB with multiple thickness regions on the same board, used where one part of the assembly has to slot into a thinner pocket while the rest carries a thicker, multi-layer routing zone. Depth-controlled milling or selective lamination forms the steps, and surface finish, solder mask, and silkscreen are continued cleanly across the transition. The shape lets a single PCB serve as both connector tongue and main board, removing one cable or one board-to-board connector from the bill of materials. Typical uses are SD-card and SIM-card style modules, hot-swap inserts, slot-in instrumentation modules, optical transceiver tongues, and consumer dongles where the host socket dictates a thin nose with thicker electronics behind it.

Specs

Characteristicstepped/ladder-profile board with multiple thickness regions

Applications

TelecomDatacenterConsumer ElectronicsInstrumentationIndustrial Control