Instrument Panel PCB

A 12-layer instrument panel PCB at 1.6±0.16mm thickness with ENIG surface finish and blind-via construction connecting outer signal layers to inner reference and signal planes. Blind vias keep solder-side pads clear and free routing channels under fine-pitch BGA and QFN packages used by automotive cluster SoCs, gauge drivers, and CAN/LIN transceivers. The 12-layer stack hosts the high-speed display interface (LVDS or similar) on dedicated signal pairs while keeping power islands for analog backlight drivers and warning-lamp circuits separated from the digital domain. Typical applications include digital and hybrid instrument clusters, head-up display drivers, EV battery state-of-charge displays, and infotainment cluster modules in passenger cars and commercial vehicles.