
A 2-layer thin PCB on S1170G high-Tg laminate at 0.3±0.05mm thickness with OSP surface finish, used as the control and sensing board in industrial film and electrolytic capacitor assemblies. The thin profile lets the PCB sit flat against capacitor cans inside drives, UPS units, and power supply modules, sharing chassis space with bulk passive components. S1170G's elevated Tg sustains operating temperature near hot capacitor banks where ambient board temperature can exceed 100°C. OSP delivers a clean, planar copper surface for SMT assembly while remaining cost-efficient for high-volume industrial production. Typical use cases include capacitor monitoring boards inside servo drives, EV charging-station rectifiers, solar string inverters, motor starter modules, and DC-link voltage sensing boards. Production requires rigid carrier support during fabrication and assembly to handle the 0.3mm panel without warpage.
Specs
| Layers | 2 |
| Material | S1170G |
| Board Thickness | 0.3±0.05mm |
| Surface Finish | OSP |
| Characteristic | thin board |
Applications