Industrial Control Bonding PCB

A bonding PCB for industrial-control power equipment, built on SI10U (S) high-Tg laminate at 0.6±0.08mm thickness, combining one stage of HDI with depth-controlled drilled holes that hold ≥35um plated-through-hole copper. ENIG surface finish gives flat, oxidation-resistant pads suited to wire bonding, fine-pitch chip mounting, and reliable solder joints under repeated thermal cycling. Bonding construction laminates multiple sub-cores together to embed power planes and shielding layers next to high-current control circuitry. Typical applications include programmable logic controllers, AC and servo drives, motor-control inverters, instrumentation amplifiers, and robotic joint controllers where thin profile, high routing density, and stable depth-controlled vias matter for assembling power and signal sections in the same enclosure.