Immersion Silver Surface PCB

A 12-layer PCB at 1.5±0.15mm thickness with immersion silver (ImAg) surface finish, optimized for high-frequency RF and high-speed digital applications where solderability and signal performance both matter. ImAg delivers a flat, lead-free pad surface with low insertion loss compared to HASL, and outperforms ENIG on RF skin-effect performance because of silver's lower volume resistivity. The 12-layer stackup supports controlled-impedance differential pairs, multiple reference planes, and dense BGA fanout typical of modern communication and computing boards. Pad flatness improves yield on fine-pitch QFN, BGA, and 0.4mm-pitch CSP devices. Typical use cases include 5G base-station radio cards, automotive infotainment processors, AI accelerator daughter cards, telecom line cards, and high-speed data-center backplanes. Production requires careful immersion bath chemistry control and final cleanroom packaging to limit silver tarnishing prior to assembly.