High Thermal Conductivity Material Board

A 6-layer board on ST110 high-thermal-conductivity laminate at 1.6±0.15mm finished thickness, with immersion tin finish and a rated thermal conductivity of 1.0 W/m·K. ST110 sits between conventional FR-4 (around 0.3-0.4 W/m·K) and metal-core boards in heat-handling capability, which makes it a good fit for designs where heat must be pulled out of high-current devices but full insulated metal substrate construction would be too rigid or expensive. The 6-layer stack lets the designer dedicate inner layers to thermal copper while still routing dense control signals on the surface. Typical applications include high-power LED lighting, automotive lighting and driver modules, power-electronics subassemblies, EV onboard electronics, and industrial control boards with localized heat sources.