
A 2-layer high-frequency PCB at 0.8±0.1mm finished thickness, optimized for high-speed signal transmission with controlled dielectric performance. The thin core keeps loop inductance low and helps preserve signal edges in fast switching circuits, while the simple two-layer structure keeps cost predictable for medium-volume builds. Sihui Fuji controls etch tolerance and copper thickness to keep impedance and insertion loss inside the customer's specified window. Typical uses include wireless transceiver boards, signal-conditioning modules in telecom equipment, low-power 5G subassemblies, instrumentation front-ends, and industrial control nodes that need stable behavior above a few hundred MHz. The board is well suited as a building block in larger systems where a dense multilayer is overkill but FR-4 cannot meet the loss budget.
Specs
| Layers | 2 |
| Board Thickness | 0.8±0.1mm |
| Characteristic | high frequency, high speed |
Applications