
A multilayer embedded magnetic ring PCB that integrates the magnetic core inside an HDI board to save space, suppress electromagnetic interference, optimize inductance behavior, improve thermal management, and maintain mechanical stability. The process supports 2-14 layers, 1-3.5 mm magnetic ring thickness, 10-35 mm magnetic core size, 3/3 mil inner routing, 3.5/3.5 mil outer routing, 0.10 mm laser vias, 0.15 mm mechanical drilling, 4 mil minimum annular rings, 16:1 through-hole aspect ratio, and ENIG, ENEPIG, Flash Gold, Hard Gold, or OSP finishes.
Specs
| Structure | Multilayer embedded magnetic ring, HDI structure |
| Layers | 2-14 |
| Magnetic Ring Thickness | 1-3.5 mm |
| Magnetic Core Size | 10-35 mm |
| Line / Space | 3/3 mil inner, 3.5/3.5 mil outer |
| Min Hole Size | 0.10 mm laser / 0.15 mm mechanical |
| Min Annular Ring | 4 mil |
| Hole-to-Conductor Spacing | 5 mil up to 6L, 6 mil for 7-11L, 8 mil for 12L+ |
| Aspect Ratio | 1:1 blind vias; 16:1 through holes |
| Dimensional Tolerance | +/-0.10 mm, special +/-0.05 mm |
| Surface Finish | ENIG, ENEPIG, Flash Gold, Hard Gold, OSP |
Applications