PRODUCT SPEC
Embedded Ceramic PCB
A multilayer embedded ceramic PCB for compact high-reliability modules that need strong heat dissipation and CTE matching. Compared with embedded copper block structures, embedded ceramic supports thinner, lighter, higher-density routing while keeping ceramic CTE close to semiconductor materials to reduce thermal stress during temperature cycling. Capabilities include 2-20 layers, 0.25-2 mm ceramic thickness, 5-50 mm ceramic size, 3/3 mil inner routing, 3.5/3.5 mil outer routing, 0.10 mm laser vias, and 16:1 through-hole aspect ratio. Typical uses include automotive charging-interface modules and LiDAR modules.
Specs
| Structure | Multilayer embedded ceramic, single-side embedding, HDI structure |
| Layers | 2-20 |
| Ceramic Thickness | 0.25-2 mm |
| Ceramic Size | 5-50 mm |
| Line / Space | 3/3 mil inner, 3.5/3.5 mil outer |
| Min Hole Size | 0.10 mm laser / 0.15 mm mechanical |
| Min Annular Ring | 4 mil |
| Hole-to-Conductor Spacing | 5 mil up to 6L, 6 mil for 7-11L, 8 mil for 12L+ |
| Aspect Ratio | 1:1 blind vias; 16:1 through holes |
| Dimensional Tolerance | +/-0.10 mm, special +/-0.05 mm |
| Surface Finish | ENIG, ENEPIG, Flash Gold, Hard Gold, OSP |
Applications
AutomotiveEVSemiconductorPower ElectronicsIndustrial Control
