Display Module Board

A 12-layer 2+8+2 HDI PCB on S1000-2M FR-4, 1.2±0.1mm thick, combining mechanical vias at φ1.90mm with laser microvias at φ0.10mm and buried vias at φ0.20mm. The 2+8+2 stackup places HDI build-up layers on both outer faces around an 8-layer core, giving the design enough fan-out resolution for high-pin-count display driver ICs and timing controllers, plus impedance-controlled differential pairs for MIPI-DSI, eDP, and LVDS lanes. The mix of mechanical, laser, and buried vias lets each connection use the shortest route through the stack at the right cost point, while the deep mechanical via supports rugged through-board mounting and grounding. The 1.2mm thickness keeps the assembled module thin enough for slim bezels. Typical fits are LCD and OLED module driver boards, automotive cluster and infotainment displays, industrial HMI panels, large-format signage controllers, and high-resolution medical and instrumentation displays.