Depth-controlled Bonding Board

A 4-layer PCB on S1000-2M FR-4, 1.6±0.16mm thick, with depth-controlled bonding cavities milled to a tightly held Z-axis tolerance. The cavities expose specific inner-layer pads or pockets at a controlled depth, so bare-die ICs, RF modules, or sensor packages can be dropped in flush with surrounding traces and wire-bonded or flip-chip attached without standing proud of the board surface. Holding the cavity depth tight is what lets the wire-bond loop heights stay short and reliable, and it is what lets a mounted module sit at the correct Z-height inside an enclosure. The S1000-2M base provides good through-life dimensional stability needed for the milling step. Typical fits are RF and microwave modules with embedded dies, sensor sub-modules, optical transmit/receive sub-assemblies, instrumentation front-ends, and aerospace avionics modules.