Copper Column PCB

A 2-layer PCB with embedded copper columns, built on S1000-2M FR-4, 1.9±0.19mm thick, with a minimum drill of φ0.20mm and minimum through-hole copper of 20μm. Solid copper columns are pressed through the board between the top and bottom copper, giving a vertical metal path with much higher current capacity and lower thermal resistance than a plated via array. This is the standard construction for the internal RF and power stages of a 5G base station, where the front-end PA generates a concentrated thermal load and where ground continuity through the board needs to behave electrically as one solid copper block. The 2-layer build keeps the path from the heat source to the heatsink as short as possible. Typical fits are 5G PA modules, RRU power stages, microwave repeater amplifier boards, and high-current DC-DC stages used inside RF subassemblies.