Consumer 4-Stage HDI PCB

A 10-layer 4-stage HDI PCB on R-5775G high-speed laminate at 1.5±0.15mm thickness, built with four sequential laser-drilled microvia layers that allow ultra-dense routing under fine-pitch BGA and SoC packages. The 4-stage stackup supports any-layer interconnect with stacked or staggered microvias, achieving the routing density required by modern smartphone, tablet, smartwatch, and TWS earbud mainboards. R-5775G provides the controlled Dk and Df needed for high-speed memory interfaces, MIPI camera links, and gigabit Ethernet PHYs that have migrated into premium consumer products. Typical use cases include flagship phone main PCBs, tablet logic boards, premium wearable mainboards, smart speaker SoC modules, and high-end action cameras. Production requires four sequential laser-drill, plate, and lamination passes with strict registration control to maintain microvia stack alignment across stages.