
A 2-layer composite PCB built around an embedded copper core sandwiched in S1000-2M dielectric, at 1.2±0.12mm finished thickness with ENIG finish. The copper core acts as a built-in heat spreader and a low-impedance return path, which lets the board run high-current LED arrays, power conversion stages, or motor-drive output stages without the localized hot spots that show up on plain FR-4. The S1000-2M dielectric handles the thermal cycling that comes with switching power loads, and the 2-layer surface routing keeps assembly simple. ENIG keeps connector pads flat and oxidation-resistant. Typical applications include high-power LED lighting modules, power-electronics output stages, automotive lamp drivers, EV charging-stage subassemblies, and industrial control boards with concentrated thermal loads.
Specs
| Layers | 2 |
| Material | S1000-2M with copper core |
| Board Thickness | 1.2±0.12mm |
| Surface Finish | ENIG |
Applications