Camera Sensor Module PCB

A 6-layer PCB on S1000-2M FR-4 laminate at 1.4±0.14mm thickness with ENIG finish, used as the carrier board for CMOS image sensor and ISP modules. The 6-layer stackup provides controlled-impedance MIPI CSI-2 differential pairs from the sensor to the host SoC, dedicated reference planes for clean image data, and isolated analog supply rails to minimize noise on dark-current-sensitive sensor inputs. ENIG offers flat solder pads for the BGA-style image sensor package and ensures reliable wirebond or flip-chip assembly. The thicker 1.4mm form provides mechanical stability for lens mount alignment and active-alignment focusing during module assembly. Typical use cases include automotive ADAS cameras, surround-view systems, smartphone main cameras, security and surveillance cameras, surgical endoscopes, and industrial machine-vision modules. Production requires impedance verification on MIPI lanes and tight Z-axis flatness to support optical alignment tolerances.