Bonding PCB Board

A PCB engineered for chip-on-board and wire-bonding assembly, using bondable hard gold over nickel on the bond pads and a tightly controlled pad surface profile. The gold layer is plated thick and pure enough to form reliable gold or aluminum wedge bonds without nickel diffusion, and the pads are kept flat and planar across the bonding area to keep capillary travel and bond force consistent. Solder mask is opened with sharp, well-defined edges around the bond zone so the wire arc is not obstructed. Typical uses are sensor modules with bare die, optical transceiver subassemblies, RF and microwave hybrids, medical implant electronics, and instrumentation front-ends where the silicon is bonded directly onto the board to minimize parasitic inductance.