24-Layer Square Rigid PCB

A 24-layer square FR-4 rigid PCB with green solder mask, white silkscreen, and ENIG finish, designed for high-density compute and switching boards. The 16:1 thickness-to-aperture ratio puts the through-hole plating process at the deep end of typical capability—uniform copper deposition in long, narrow vias requires good throwing power and pulsed plating, plus careful smear and etchback removal so the inner-layer connections are clean. Inter-layer offset is held tight enough that controlled-impedance traces stay inside the design tolerance window across all layers. ENIG gives a flat, lead-free-friendly pad surface for fine-pitch BGAs. Typical uses are AI-server compute boards, network switch line cards, 5G baseband boards, telecom infrastructure, and high-end industrial control systems where 24-layer routing density is the minimum to close the design.