22-Layer Long Size Board

A 22-layer long-format PCB measuring 830x338mm at 4.8mm thickness, sized as a backplane or motherboard for high-density telecom and server systems. The high layer count gives enough plane and signal-routing real estate for many power rails, dense differential pairs, and isolation between RF or high-speed buses, while the long aspect ratio is required to span chassis-width slots. Lamination registration and through-thickness symmetry are the dominant manufacturing constraints—any layer-to-layer offset on a 22-layer stack opens up impedance and crosstalk problems on the long traces. Typical uses are switch and router backplanes, telecom rack motherboards, AI-server compute and accelerator backplanes, 5G base-station backhaul cards, and industrial control mainboards where the board has to span a full chassis.