0.2mm Ultra-Thin PCB

A 2-layer ultra-thin PCB on S1000H FR-4 laminate at only 0.2mm finished thickness, fabricated with laser drilling for sub-0.1mm microvia formation and ENIG surface finish. The thin core enables card-style and flexible-feel form factors for wearable bands, hearable earpieces, smart card modules, medical sensor patches, and embedded IoT tags where overall product thickness is the primary design constraint. ENIG ensures flat, oxidation-resistant pads for reliable fine-pitch component assembly on this delicate substrate. Laser drilling provides the precision needed to land microvias on small annular rings without breakout, and CO2 or UV laser parameters are tuned to the thin dielectric to avoid copper damage. Typical use cases also include disposable diagnostic sensors, miniature camera modules, and slim consumer wearables. Manufacturing requires careful panelization and rigid carrier support to prevent warpage during lamination, drilling, and reflow.