Ceramic substrate refers to a special process board in which copper foil is directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single-sided or double-sided) at high temperature. The resulting ultra-thin composite substrate has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can be etched into various patterns like a PCB, and has a large current carrying capacity. Ability. Therefore, ceramic substrates have become the basic materials for high-power electronic circuit structure technology and interconnection technology.
