◆Strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong bonding force, anti-corrosion. ◆ Good thermal cycle performance, the number of cycles is up to 50,000 times, and the reliability is high. ◆Same as PCB (or IMS substrate), it can etch out various pattern structures; no pollution and no pollution. ◆The operating temperature is -55℃～850℃; the thermal expansion coefficient is close to silicon, which simplifies the production process of the power module.
