While electronic design is constantly improving the performance of the whole machine, it is also trying to reduce its size. In small portable products from mobile phones to smart weapons, "small" is the eternal pursuit. High Density Integration (HDI) technology enables more miniaturization of end product designs while meeting higher standards for electronic performance and efficiency. HDI is widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method. Ordinary HDI boards are basically one-time buildup, and high-end HDI uses two or more buildup technologies, while using advanced PCB technologies such as stacking, electroplating, and laser direct drilling. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc. Development prospects: According to the use of high-end HDI boards - 3G boards or IC substrates, its future growth is very rapid: the world's 3G mobile phone growth will exceed 30% in the next few years, and China will soon issue 3G licenses; IC substrate industry consulting Institution Prismark predicts that China's forecast growth rate from 2005 to 2010 is 80%, which represents the technical development direction of PCB.
