
A 2-layer single-side rigid-flex PCB combining S1000-2M rigid laminate and IF-2LD5018J2 flex film, with 1.6±0.16mm total thickness and ENIG surface finish. The single-side flex topology routes signals on one copper layer of the flex section between two rigid sub-boards, providing a low-cost rigid-flex option for cost-sensitive consumer and industrial assemblies that still need to fold inside a chassis or eliminate a board-to-board connector. Typical applications include compact IoT sensor nodes, in-vehicle entertainment interface boards, white-goods control panels, and industrial handheld terminals. ENIG keeps the surface flat and oxidation-resistant for fine-pitch SMD reflow. Manufacturing combines rigid sub-board build-up with selective adhesive lamination of the flex zone, controlled-depth routing, and registration to maintain consistent bend reliability across production volumes.
Specs
| Layers | 2 |
| Material | S1000-2M+IF-2LD5018J2 |
| Board Thickness | 1.6±0.16mm |
| Surface Finish | ENIG |
Applications