Sandwich Copper PCB

A 3-layer rigid-flex PCB with a sandwich copper core, combining IF-2LD flex laminate, S1000-2MB rigid material, and a heavy copper core layer at 1.5±0.15mm total thickness with ENIG surface finish. Inner and outer layer copper thicknesses are independently engineered: heavy copper at the core handles high-current power distribution and acts as a thermal spreader, while thinner outer copper supports signal routing and surface-mount component pads. The flex region of the construction allows the assembly to fold inside power-electronics enclosures and automotive control units. Typical applications include EV traction inverters, charger boards, motor-drive bus distribution, and industrial high-current control modules. Manufacturing combines heavy-copper core lamination with selective polyimide flex bonding, controlled-depth drilling, and copper plating tuned for high-current contact reliability.