Power System Rigid-Flex PCB

A 4-layer rigid-flex PCB designed for power electronics subsystems, combining IF-2LD flex laminate with S1000H rigid material at 1.2±0.12mm thickness. The surface uses an Sn-Ni-Cu finish chosen for power-handling robustness and contact reliability under repeated thermal cycling. The 4-layer rigid stack supports DC bus distribution, gate-drive routing, and current-sense circuits, while the flex transition routes control and sense signals between separate rigid power stages without harness wiring. Typical applications include compact power supplies, battery management subassemblies, EV traction inverter control boards, energy storage gateway boards, and industrial drive auxiliary controllers. Manufacturing combines high-current copper imaging on the rigid sections with selective polyimide bonding in the flex zone, controlled-depth routing, and surface plating tuned for power-grade contact wear.