PRODUCT SPEC
Rigid-Flex PCB
A rigid-flex PCB capability covering 2-28 layer builds with multilayer flexible split or bonded structures and optional HDI construction. It supports modular product design, three-dimensional installation, weight reduction, high-density thin routing, high-reliability applications, and dynamic bending where required. Process limits include 3 mm minimum flexible area width, 2/2 mil inner and outer routing, 0.05 mm laser vias, 0.15 mm mechanical drilling, 4 mil minimum annular ring, 20:1 through-hole aspect ratio, and multiple surface finishes including ENIG, ENEPIG, HASL, Flash Gold, Hard Gold, and OSP.
Specs
| Structure | Multilayer flexible split or bonded structure, HDI structure |
| Layers | 2-28 |
| Min Flexible Area Width | 3 mm |
| Line / Space | 2/2 mil inner and outer layers |
| Min Hole Size | 0.05 mm laser / 0.15 mm mechanical |
| Min Annular Ring | 4 mil |
| Hole-to-Conductor Spacing | 5 mil up to 6L, 6 mil for 7-11L, 8 mil for 12L+ |
| Aspect Ratio | 1:1 blind vias; 20:1 through holes |
| Dimensional Tolerance | +/-0.10 mm, special +/-0.05 mm |
| Surface Finish | ENIG, ENEPIG, HASL, Flash Gold, Hard Gold, OSP |
Applications
MedicalAutomotiveIndustrial ControlConsumer ElectronicsAerospace
