Inertial Integrated Navigation PCB

A 14-layer rigid-flex PCB with 1-stage HDI, designed for inertial integrated navigation systems that fuse IMU, GNSS, and odometry data. The stack-up combines S1000-2M rigid material with IF-2LD5018 flex laminate at 1.6±0.16mm total thickness and ENIG surface finish, with a minimum drilled diameter of 0.18mm to support fine-pitch BGA processors and tight-pitch RF connectors. The rigid-flex topology lets the navigation board fold to align IMU axes with the host platform without harness assemblies, which is critical for vehicle navigation, UAV autopilots, missile guidance, satellite payloads, and surveying instruments. HDI build-up provides routing density for high-speed differential pairs between the inertial sensor cluster, GNSS front-end, and central processor, while ENIG ensures stable solder joints under wide thermal cycling.