Industrial Control Semi-Flex PCB

An 8-layer semi-flex PCB built on SB170G laminate at 1.676±0.1676mm thickness with ENIG finish, intended for industrial control units that require a single permanent bend during cabinet assembly. Semi-flex construction uses a controlled-depth-milled bend zone instead of full polyimide flex film, lowering material cost while still allowing the board to be folded once into chassis, drives, or mounting brackets. The 8-layer rigid stack supports impedance-controlled signaling, multi-rail power distribution, and dense BGA breakout for industrial MCUs and FPGAs. Typical applications include PLC processor cards, motor-drive control boards, sensor concentrators, and rack-mounted instrumentation back planes where a one-time L-shape installation is required. ENIG provides the flat solderable surface needed for fine-pitch reflow and consistent contact for spring-loaded probe testing.