
A 2-layer flexible PCB built on IF-2LD polyimide laminate at 0.18±0.03mm thickness with OSP surface finish, designed for industrial control wiring. The thin double-layer construction routes power and digital signals between motor windings, sensor heads, and controller boards inside cabinets, drives, and machine tool enclosures where mechanical bending, vibration, or repeated motion would damage rigid cabling. OSP delivers a flat, solderable copper surface suitable for high-volume reflow assembly while keeping cost low for harness-replacement applications. Typical deployments include AC drive interconnects, encoder feedback loops, sensor-to-controller wiring on robotic arms, and rolling-cable replacements in CNC machinery. Manufacturing involves precision copper imaging on rolled-annealed copper, polyimide coverlay lamination, and final flex routing to drop-in form factors.
Specs
| Layers | 2 |
| Material | IF-2LD |
| Board Thickness | 0.18±0.03mm |
| Surface Finish | OSP |
Applications