PRODUCT SPEC
Flexible PCB
A flexible PCB capability for 1-12 layer FPC builds with multilayer flexible split or bonded structures and optional HDI construction. It supports modular design, three-dimensional installation, weight reduction, high-density thin routing, high-reliability applications, and dynamic bending as required. Capabilities include 2 mm minimum flexible area width, 2/2 mil inner and outer routing, 0.05 mm laser vias, 0.15 mm mechanical drilling, 4 mil annular rings, 20:1 through-hole aspect ratio, and ENIG, ENEPIG, Flash Gold, Hard Gold, or OSP finishes.
Specs
| Structure | Multilayer flexible split or bonded structure, HDI structure |
| Layers | 1-12 |
| Min Flexible Area Width | 2 mm |
| Line / Space | 2/2 mil inner and outer layers |
| Min Hole Size | 0.05 mm laser / 0.15 mm mechanical |
| Min Annular Ring | 4 mil |
| Hole-to-Conductor Spacing | 6 mil up to 6L, 8 mil for 7-11L, 12 mil for 12L+ |
| Aspect Ratio | 1:1 blind vias; 20:1 through holes |
| Dimensional Tolerance | +/-0.10 mm, special +/-0.05 mm |
| Surface Finish | ENIG, ENEPIG, Flash Gold, Hard Gold, OSP |
Applications
AutomotiveMedicalConsumer ElectronicsWearableIndustrial Control
