
A 2-layer flexible PCB built on IF-2LD2518NJ2 polyimide laminate at 0.20±0.05mm thickness with ENIG surface finish, qualified for automotive interconnect applications. The double-layer flex construction routes power and signal between body-control modules, lighting clusters, instrument panels, and battery sense lines without the bulk and connector count of conventional copper harnesses. ENIG provides a thermally stable, oxidation-resistant solder surface for reflow assembly of small SMD components used in automotive sensor packs and EV battery management subassemblies. Typical deployments include door wiring replacements, dashboard backlight buses, LED tail-light boards, BMS cell-balancing flex, and HVAC actuator interconnects. Manufacturing involves rolled-annealed copper imaging, polyimide coverlay lamination, and laser cutting to drop-in profiles that match harness routing in vehicle assembly lines.
Specs
| Layers | 2 |
| Material | IF-2LD2518NJ2 |
| Board Thickness | 0.20±0.05mm |
| Surface Finish | ENIG |
Applications