6-Layer Rigid-Flex Board

A 6-layer rigid-flex PCB providing balanced multilayer routing in the rigid sections and an integrated polyimide flex zone for compact 3D assembly. The 6-layer count is the typical choice for handheld devices, foldable consumer products, and module-style industrial assemblies that need to host a microcontroller, mixed analog and digital circuitry, and a small radio without resorting to higher-cost HDI builds. The flex transition replaces the wire harness or board-to-board connector that would otherwise be required, reducing assembly time and removing a known field-failure mode. Manufacturing combines rigid sub-board build-up with selective adhesive lamination of the flex layers, controlled-depth drilling, and registration to achieve consistent bend reliability and impedance behavior across production volumes.